Interfacial bonding enhances thermoelectric cooling in 3D-printed materials | Science

Interfacial bonding enhances thermoelectric cooling in 3D-printed materials | Science

Thermoelectric coolers (TECs) are pivotal in modern heat management but face limitations in efficiency and manufacturing scalability. We address these challenges by using an extrusion-based 3D printing technique to fabricate high-performance … Thermoelectric coolers (TECs) are pivotal in modern heat management but face limitations in efficiency and manufacturing scalability. We address these challenges by using an extrusion-based 3D printing technique to fabricate high-performance …  Science

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