In recent years, the high complexity of integrated devices has made heat accumulation increasingly critical and has resulted in higher heat dissipation requirements for substrates and packaging materials. In this study, boron nitride microribbon (BNMR)/Al2O3 composite ceramics are prepared using spark plasma sintering (SPS). In recent years, the high complexity of integrated devices has made heat accumulation increasingly critical and has resulted in higher heat dissipation requirements for substrates and packaging materials. In this study, boron nitride microribbon (BNMR)/Al2O3 composite ceramics are prepared using spark plasma sintering (SPS). Analytical Chemistry Materials Science Phys.org – latest science and technology news stories
November 20, 2024
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